Please use this identifier to cite or link to this item:
https://doi.org/10.1109/ITHERM.2006.1645340
DC Field | Value | |
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dc.title | An experimental study of slot-jet impingement and mist cooling of microprocessors | |
dc.contributor.author | Tay, A.A.O. | |
dc.contributor.author | Ang, S.S.T. | |
dc.contributor.author | Lwin, L.O. | |
dc.date.accessioned | 2014-06-19T05:31:58Z | |
dc.date.available | 2014-06-19T05:31:58Z | |
dc.date.issued | 2006 | |
dc.identifier.citation | Tay, A.A.O.,Ang, S.S.T.,Lwin, L.O. (2006). An experimental study of slot-jet impingement and mist cooling of microprocessors. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2006 : 175-180. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ITHERM.2006.1645340" target="_blank">https://doi.org/10.1109/ITHERM.2006.1645340</a> | |
dc.identifier.isbn | 0780395247 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/73169 | |
dc.description.abstract | This paper describes an experimental study of air slot-impingement and mist cooling of microchannels fabricated on the back of a silicon chip. A rig was designed and fabricated for the experimental study. The test section consisted of a 21mm × 21mm square silicon die with 100μm-wide microchannels etched on its back surface, which were covered with a glass plate to confine the flow through the microchannels. A slot was machined across the glass cover plate to admit air from an inlet manifold. The performance of an air-water mist spray cooling system was also studied experimentally. It was found that an air-water mist spray cooling system can give a higher cooling rate than air-only slot-impingement cooling of microchannels. For the same heat dissipation, it was found that the air-water mist spray cooling system required a much smaller flow rate of air. Comparing with data available in the literature, it was also found that mist cooling of microchannels was much more effective than on plane surfaces. © 2006 IEEE. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/ITHERM.2006.1645340 | |
dc.source | Scopus | |
dc.type | Conference Paper | |
dc.contributor.department | MECHANICAL ENGINEERING | |
dc.description.doi | 10.1109/ITHERM.2006.1645340 | |
dc.description.sourcetitle | Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference | |
dc.description.volume | 2006 | |
dc.description.page | 175-180 | |
dc.description.coden | PITEF | |
dc.identifier.isiut | NOT_IN_WOS | |
Appears in Collections: | Staff Publications |
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