Please use this identifier to cite or link to this item: https://doi.org/10.1109/ITHERM.2006.1645340
DC FieldValue
dc.titleAn experimental study of slot-jet impingement and mist cooling of microprocessors
dc.contributor.authorTay, A.A.O.
dc.contributor.authorAng, S.S.T.
dc.contributor.authorLwin, L.O.
dc.date.accessioned2014-06-19T05:31:58Z
dc.date.available2014-06-19T05:31:58Z
dc.date.issued2006
dc.identifier.citationTay, A.A.O.,Ang, S.S.T.,Lwin, L.O. (2006). An experimental study of slot-jet impingement and mist cooling of microprocessors. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2006 : 175-180. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ITHERM.2006.1645340" target="_blank">https://doi.org/10.1109/ITHERM.2006.1645340</a>
dc.identifier.isbn0780395247
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73169
dc.description.abstractThis paper describes an experimental study of air slot-impingement and mist cooling of microchannels fabricated on the back of a silicon chip. A rig was designed and fabricated for the experimental study. The test section consisted of a 21mm × 21mm square silicon die with 100μm-wide microchannels etched on its back surface, which were covered with a glass plate to confine the flow through the microchannels. A slot was machined across the glass cover plate to admit air from an inlet manifold. The performance of an air-water mist spray cooling system was also studied experimentally. It was found that an air-water mist spray cooling system can give a higher cooling rate than air-only slot-impingement cooling of microchannels. For the same heat dissipation, it was found that the air-water mist spray cooling system required a much smaller flow rate of air. Comparing with data available in the literature, it was also found that mist cooling of microchannels was much more effective than on plane surfaces. © 2006 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/ITHERM.2006.1645340
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1109/ITHERM.2006.1645340
dc.description.sourcetitleThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
dc.description.volume2006
dc.description.page175-180
dc.description.codenPITEF
dc.identifier.isiutNOT_IN_WOS
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