Please use this identifier to cite or link to this item:
|Title:||A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging|
|Citation:||Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Iyer, M.K. (2006). A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 1246-1250. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645812|
|Abstract:||A novel compliant flip-chip interconnect in the form of a planar microspring is presented in this paper. Different spring geometries are evaluated and compared in terms of compliances and electrical parasitics. It is shown that the J-shape spring design gives a better balanced performance. Further numerical studies reveal the geometric dependence of the compliances of J-shape spring interconnects, and also the influence of the sacrificial material upon the electrical performance of the interconnects. The wafer-level process flow for fabrication of the planar microspring interconnects is described and discussed. Prototype interconnects are fabricated by combining planar technology and 3D surface micromachining technology. © 2006 IEEE.|
|Source Title:||Proceedings - Electronic Components and Technology Conference|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Dec 11, 2018
WEB OF SCIENCETM
checked on Dec 3, 2018
checked on Oct 27, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.