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Title: A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging
Authors: Liao, E.B.
Tay, A.A.O. 
Ang, S.S.T.
Feng, H.H.
Nagarajan, R.
Kripesh, V.
Kumar, R.
Iyer, M.K.
Issue Date: 2006
Citation: Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Iyer, M.K. (2006). A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 1246-1250. ScholarBank@NUS Repository.
Abstract: A novel compliant flip-chip interconnect in the form of a planar microspring is presented in this paper. Different spring geometries are evaluated and compared in terms of compliances and electrical parasitics. It is shown that the J-shape spring design gives a better balanced performance. Further numerical studies reveal the geometric dependence of the compliances of J-shape spring interconnects, and also the influence of the sacrificial material upon the electrical performance of the interconnects. The wafer-level process flow for fabrication of the planar microspring interconnects is described and discussed. Prototype interconnects are fabricated by combining planar technology and 3D surface micromachining technology. © 2006 IEEE.
Source Title: Proceedings - Electronic Components and Technology Conference
ISBN: 1424401526
ISSN: 05695503
DOI: 10.1109/ECTC.2006.1645812
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