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|Title:||A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging|
|Citation:||Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Iyer, M.K. (2006). A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 1246-1250. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645812|
|Abstract:||A novel compliant flip-chip interconnect in the form of a planar microspring is presented in this paper. Different spring geometries are evaluated and compared in terms of compliances and electrical parasitics. It is shown that the J-shape spring design gives a better balanced performance. Further numerical studies reveal the geometric dependence of the compliances of J-shape spring interconnects, and also the influence of the sacrificial material upon the electrical performance of the interconnects. The wafer-level process flow for fabrication of the planar microspring interconnects is described and discussed. Prototype interconnects are fabricated by combining planar technology and 3D surface micromachining technology. © 2006 IEEE.|
|Source Title:||Proceedings - Electronic Components and Technology Conference|
|Appears in Collections:||Staff Publications|
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