Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.711688
Title: A heater plate assisted integrated bake/chill system for photoresist processing
Authors: Chua, H.-T. 
Tay, A.
Wang, Y.
Wu, X.
Keywords: Lithography
Mica heater
Temperature control
Thermoelectric
Issue Date: 2007
Source: Chua, H.-T., Tay, A., Wang, Y., Wu, X. (2007). A heater plate assisted integrated bake/chill system for photoresist processing. Proceedings of SPIE - The International Society for Optical Engineering 6519 (PART 2) : -. ScholarBank@NUS Repository. https://doi.org/10.1117/12.711688
Abstract: A thermal processing module, which consists of a dense distribution of multivariate controlled heat/chill elements, is developed to achieve temperature uniformity of a silicon wafer throughout the processing temperature cycle of ramp, hold and quench in microlithography. In the proposed unit, the bake and chill steps are conducted sequentially within the same module without any substrate movement. The unit includes two heating sources. The first is a mica heater which serves as the dominant means for heat transfer. The second is a set of thermoelectric devices (TEDs) which are used to provide a distributed amount of heat to the substrate for uniformity and transient temperature control. The TEDs also provide active cooling for chilling the substrate to a temperature suitable for subsequent processing steps. The feasibility of a practical system is demonstrated via detailed modeling and simulations based on first principle heat transfer analysis.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/73030
ISBN: 0819466387
ISSN: 0277786X
DOI: 10.1117/12.711688
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