Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/72902
Title: Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation
Authors: Wong, W.K.
Yin, Q.R.
Thong, J.T.L. 
Phang, J.C.H. 
Fang, J.W.
Issue Date: 2000
Source: Wong, W.K.,Yin, Q.R.,Thong, J.T.L.,Phang, J.C.H.,Fang, J.W. (2000). Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation. Conference Proceedings from the International Symposium for Testing and Failure Analysis : 11-16. ScholarBank@NUS Repository.
Abstract: This paper describes Scanning Electron Acoustic Microscopy (SEAM) applications, particularly to samples that are of interest to the microelectronics industry. Several applications of SEAM involving semiconductor and ferroelectric samples are discussed in this paper. The expanding scope of applications for SEAM presents exciting possibilities. The challenge ahead lies in understanding the contrast mechanisms in SEAM signal formation as well as correlating results to the physical properties of samples.
Source Title: Conference Proceedings from the International Symposium for Testing and Failure Analysis
URI: http://scholarbank.nus.edu.sg/handle/10635/72902
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

34
checked on Dec 9, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.