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|Title:||IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.|
|Authors:||Ngan, King N. |
Kang, Sing B.
|Source:||Ngan, King N.,Kang, Sing B. (1988). IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION. : 1850-1851. ScholarBank@NUS Repository.|
|Abstract:||An algorithm that has been developed to inspect the integrity of wire bonds on an IC die is described. The algorithm uses of an elliptical model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. Missing bonds and double bonds can also be detected.|
|Appears in Collections:||Staff Publications|
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