Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/72680
Title: IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.
Authors: Ngan, King N. 
Kang, Sing B.
Issue Date: 1988
Source: Ngan, King N.,Kang, Sing B. (1988). IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION. : 1850-1851. ScholarBank@NUS Repository.
Abstract: An algorithm that has been developed to inspect the integrity of wire bonds on an IC die is described. The algorithm uses of an elliptical model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. Missing bonds and double bonds can also be detected.
URI: http://scholarbank.nus.edu.sg/handle/10635/72680
ISBN: 0818608528
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

59
checked on Dec 9, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.