Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/72492
Title: Application of Single Contact Optical Beam Induced Currents (SCOBIC) for Backside Failure Analysis
Authors: Palaniappan, M. 
Chin, J.M.
Phang, J.C.H. 
Chan, D.S.H. 
Soh, C.E.
Gilfeather, G.
Issue Date: 2000
Source: Palaniappan, M.,Chin, J.M.,Phang, J.C.H.,Chan, D.S.H.,Soh, C.E.,Gilfeather, G. (2000). Application of Single Contact Optical Beam Induced Currents (SCOBIC) for Backside Failure Analysis. Conference Proceedings from the International Symposium for Testing and Failure Analysis : 17-21. ScholarBank@NUS Repository.
Abstract: The Single Contact Optical Beam Induced Currents (SCOBIC) is a new failure analysis technique, which allows the imaging of junctions by a single connection to the substrate or power pin of an integrated circuit. Modern packaging technologies and multi-layer metallizations has increased the need for backside IC failure analysis. In this paper, the SCOBIC technique is used to image junctions from the die backside. The implementation of backside SCOBIC system is discussed. Application of the SCOBIC technique from both the frontside and backside of CMOS and NMOS devices are presented.
Source Title: Conference Proceedings from the International Symposium for Testing and Failure Analysis
URI: http://scholarbank.nus.edu.sg/handle/10635/72492
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

41
checked on Dec 9, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.