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|Title:||A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology|
|Citation:||Liu, J.,Cao, L.,Xie, M.,Goh, T.-N.,Tang, Y. (2004). A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology. 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 191-197. ScholarBank@NUS Repository.|
|Abstract:||In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joining technology for electronics packaging applications. The model can also be used to predict any minimum failure cycles if the maximum acceptable failure criterion (in this case, a preset electrical resistance value) is set. The original reliability testing from which the test data was obtained was carried out on Flip-Chip anisotropically conductive adhesive joints on an FR-4 substrate. In the study, nine types of anisotropic conductive adhesive (ACA) and one non-conductive film (NCF) were used. In total, nearly one thousand single joints were subjected to reliability tests in terms of temperature cycling between -40°C and 125°C with a dwell time of 15 minutes and a ramp rate of 110°C/min. The reliability was characterized by single contact resistance measured using the four-probe method during temperature cycling testing up to 3000 cycles. A single Weibull model is used for two failure definitions defined as larger than 50mΩ and larger than 100 mΩ respectively using the in-situ electrical resistance measurement technique. The failure criteria are incorporated into this Weibull model. This study shows the flexibility and usefulness of Weibull distribution in this type of applications. © 2004 IEEE.|
|Source Title:||2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics|
|Appears in Collections:||Staff Publications|
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