Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/72237
Title: A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology
Authors: Liu, J.
Cao, L.
Xie, M. 
Goh, T.-N. 
Tang, Y.
Issue Date: 2004
Source: Liu, J.,Cao, L.,Xie, M.,Goh, T.-N.,Tang, Y. (2004). A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology. 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 191-197. ScholarBank@NUS Repository.
Abstract: In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joining technology for electronics packaging applications. The model can also be used to predict any minimum failure cycles if the maximum acceptable failure criterion (in this case, a preset electrical resistance value) is set. The original reliability testing from which the test data was obtained was carried out on Flip-Chip anisotropically conductive adhesive joints on an FR-4 substrate. In the study, nine types of anisotropic conductive adhesive (ACA) and one non-conductive film (NCF) were used. In total, nearly one thousand single joints were subjected to reliability tests in terms of temperature cycling between -40°C and 125°C with a dwell time of 15 minutes and a ramp rate of 110°C/min. The reliability was characterized by single contact resistance measured using the four-probe method during temperature cycling testing up to 3000 cycles. A single Weibull model is used for two failure definitions defined as larger than 50mΩ and larger than 100 mΩ respectively using the in-situ electrical resistance measurement technique. The failure criteria are incorporated into this Weibull model. This study shows the flexibility and usefulness of Weibull distribution in this type of applications. © 2004 IEEE.
Source Title: 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics
URI: http://scholarbank.nus.edu.sg/handle/10635/72237
ISBN: 0780387449
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

20
checked on Dec 9, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.