Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/72203
Title: Wideband lumped element model for on-chip interconnects on lossy silicon substrate
Authors: Sun, S.
Kumar, R.
Rustagi, S.C.
Mouthaan, K. 
Wong, T.K.S.
Keywords: Frequency-dependent
Interconnect
Lumped element model
Silicon substrate
Transmission line
Wideband
Issue Date: 2006
Source: Sun, S.,Kumar, R.,Rustagi, S.C.,Mouthaan, K.,Wong, T.K.S. (2006). Wideband lumped element model for on-chip interconnects on lossy silicon substrate. Digest of Papers - IEEE Radio Frequency Integrated Circuits Symposium 2006 : 478-481. ScholarBank@NUS Repository.
Abstract: This work presents the fully lumped element model for wideband on-chip interconnects, with large scalability of line lengths up to 8000 μm, and widths down to 100 nm. Both the series and the shunt lumped elements of the model are determined based on the frequency asymptotic technique without any optimization. The equivalent lumped circuit is derived and verified to accurately recover the frequency-dependent parameters up to 40 GHz, where all the parasitic effects are accounted for based on the EM simulation and measurement. The convergence of the cascaded lumped element model is analyzed for the minimal requirement of desired wideband and distributed performance. The frequency responses of the proposed model agree well with those of the distributed transmission line model and measurements. Finally, the model is validated by comparing simulated and measured Scattering-parameters.
Source Title: Digest of Papers - IEEE Radio Frequency Integrated Circuits Symposium
URI: http://scholarbank.nus.edu.sg/handle/10635/72203
ISBN: 0780395727
ISSN: 15292517
Appears in Collections:Staff Publications

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