Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/71899
Title: Subsurface imaging of multi-level integrated circuits using scanning electron acoustic microscopy
Authors: Meng, L.
Street, A.G.
Phang, J.C.H. 
Issue Date: 2009
Source: Meng, L.,Street, A.G.,Phang, J.C.H. (2009). Subsurface imaging of multi-level integrated circuits using scanning electron acoustic microscopy. Conference Proceedings from the International Symposium for Testing and Failure Analysis : 27-32. ScholarBank@NUS Repository.
Abstract: The capability of the Scanning Electron Acoustic Microscopy (SEAM) technique for high resolution non-destructive subsurface imaging at different depths for a multi-level integrated circuit is assessed. Experimental results using a beveled DRAM IC sample are used to quantify the effect of the electron beam energy and modulation frequency on contrast, spatial resolution and depth of focus of SEAM amplitude and phase images. Copyright © 2009 ASM International® All rights reserved.
Source Title: Conference Proceedings from the International Symposium for Testing and Failure Analysis
URI: http://scholarbank.nus.edu.sg/handle/10635/71899
ISBN: 9781615030088
Appears in Collections:Staff Publications

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