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https://doi.org/10.1109/ICSICT.2010.5667527
Title: | Schottky barrier tuning at NiSi/Si interface using pre-silicide aluminum and sulfur co-implant | Authors: | Tong, Y. Koh, S.-M. Zhou, Q. Du, A.Y. Yeo, Y.-C. |
Issue Date: | 2010 | Citation: | Tong, Y.,Koh, S.-M.,Zhou, Q.,Du, A.Y.,Yeo, Y.-C. (2010). Schottky barrier tuning at NiSi/Si interface using pre-silicide aluminum and sulfur co-implant. ICSICT-2010 - 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Proceedings : 1021-1023. ScholarBank@NUS Repository. https://doi.org/10.1109/ICSICT.2010.5667527 | Abstract: | In this paper, we examine the physical properties of NiSi/p-Si implanted with various combinations of aluminum (Al) and sulfur (S) doses for Schottky barrier tuning. Techniques used included HRTEM, TOF-SIMS, HAADF STEM, and EDX. We also measured the integral interfacial dose (IID) of Al and S, i.e. amount of Al and S found with 2.5 nm of the interface, and correlated it to the Schottky barrier height (SBH). For the split with the same Al and S implant dose, the SBH tuning effect of Al overwhelms that of S and the extracted SBH is 0.137 eV. ©2010 IEEE. | Source Title: | ICSICT-2010 - 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Proceedings | URI: | http://scholarbank.nus.edu.sg/handle/10635/71717 | ISBN: | 9781424457984 | DOI: | 10.1109/ICSICT.2010.5667527 |
Appears in Collections: | Staff Publications |
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