Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPEP.2007.4387180
Title: Modeling of advanced multilayered packages with multiple vias and finite ground planes
Authors: Liu, E.-X.
Wei, X.
Oo, Z.Z.
Li, E.-P. 
Li, L.-W. 
Issue Date: 2007
Source: Liu, E.-X.,Wei, X.,Oo, Z.Z.,Li, E.-P.,Li, L.-W. (2007). Modeling of advanced multilayered packages with multiple vias and finite ground planes. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 275-278. ScholarBank@NUS Repository. https://doi.org/10.1109/EPEP.2007.4387180
Abstract: A system-level modeling approach, which combines the MoM (Method of Moments) and the SMM (Scattering Matrix method) has been presented for the modeling of advanced electronic packages [1]. The focus of this paper is on addressing the problems of multilaycred multiple via coupling and finite ground effects by the SMM method. Significant extensions of the SMM method facilitate the modeling of coupling among densely populated vias in multilayered packages with finite power/ground planes. The proposed approach is suitable for the signal and power integrity, and even EMI analysis of packages at system level. © 2007 IEEE.
Source Title: IEEE Topical Meeting on Electrical Performance of Electronic Packaging
URI: http://scholarbank.nus.edu.sg/handle/10635/70992
ISBN: 1424408830
DOI: 10.1109/EPEP.2007.4387180
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