Please use this identifier to cite or link to this item: https://doi.org/10.1109/IECON.2007.4459962
Title: Measurement bias detection, identification and elimination for multi-zone thermal processing in semiconductor manufacturing
Authors: Ho, W.K. 
Yan, H.
Romagnoli, J.A.
Ling, K.V.
Issue Date: 2007
Source: Ho, W.K., Yan, H., Romagnoli, J.A., Ling, K.V. (2007). Measurement bias detection, identification and elimination for multi-zone thermal processing in semiconductor manufacturing. IECON Proceedings (Industrial Electronics Conference) : 2678-2682. ScholarBank@NUS Repository. https://doi.org/10.1109/IECON.2007.4459962
Abstract: Temperature uniformity within wafer and from wafer to wafer are important issues with stringent specifications and significant impact on the smallest feature size or critical dimension. To obtain temperature uniformity, a wafer is heated by multiple independently controlled heating elements simultaneously. The accuracy of temperature measurement is an issue. Faults include sensor bias, complete failure, drifting, precision degradation etc. In this paper, we demonstrate the detection of gross errors and the elimination of biased reading in a multi-zone thermal system for semiconductor wafer processing. ©2007 IEEE.
Source Title: IECON Proceedings (Industrial Electronics Conference)
URI: http://scholarbank.nus.edu.sg/handle/10635/70897
ISBN: 1424407834
DOI: 10.1109/IECON.2007.4459962
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