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|Title:||Laser reflow plastic ball grid array|
Plastic ball grid array
Sn-Pb eutectic solder ball
|Source:||Liu, D., Chen, T., Yuan, Y., Lu, Y.F., Hong, M., Goh, R. (2002). Laser reflow plastic ball grid array. Proceedings of SPIE - The International Society for Optical Engineering 4426 : 363-366. ScholarBank@NUS Repository. https://doi.org/10.1117/12.456834|
|Abstract:||A modified fast-modulated CW Nd:YAG is used to reflow plastic ball grid array (PBGA). Sn-Pb eutectic solder balls with a diameter of 760 μm and Au-Ni-Cu solder pads are used in the study. Shear strength tests are performed to find out the optimal reflow parameters. An energy equilibrium model is proposed to estimate the average temperatures of solder joint under the given experimental conditions. Based on the experimental and theoretical results, a parameter range for laser reflow of the 760 μm SnPb eutectic solder balls is proposed.|
|Source Title:||Proceedings of SPIE - The International Society for Optical Engineering|
|Appears in Collections:||Staff Publications|
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