Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.456836
Title: Laser ablation of Si in water and ambient air
Authors: Zhu, S.
Hong, M.H. 
Koh, M.L.
Lu, Y.F. 
Keywords: Acoustic wave
Laser ablation
Real-time monitoring
Water confinement regime
Issue Date: 2002
Source: Zhu, S., Hong, M.H., Koh, M.L., Lu, Y.F. (2002). Laser ablation of Si in water and ambient air. Proceedings of SPIE - The International Society for Optical Engineering 4426 : 39-42. ScholarBank@NUS Repository. https://doi.org/10.1117/12.456836
Abstract: Laser ablation of Si in ambient air and under water is investigated. It is found that the laser ablation rate of Si varies with the thickness of the water layer above the Si substrates. The laser ablation rate is the most highly enhanced with the water layer of 1.1 mm. It is assumed that the plasma generated in water confinement regime (WCR) with an optimal water layer thickness induces the strongest pressure. This high-pressure, high-temperature plasma results in the high ablation rate. A wide-band microphone is used to detect the audible acoustic wave generated during the laser ablation. The amplitude of the acoustic wave is closely related to the ablation rate. It is found that the first peak-to-peak amplitude of the acoustic wave is the strongest when the water layer thickness is 1.1 mm above the substrate. By proper calibration, acoustic wave detection can be used as a real-time monitoring of the laser ablation.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/70756
ISSN: 0277786X
DOI: 10.1117/12.456836
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

6
checked on Dec 6, 2017

WEB OF SCIENCETM
Citations

3
checked on Nov 20, 2017

Page view(s)

27
checked on Dec 10, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.