Please use this identifier to cite or link to this item: https://doi.org/10.1109/IECON.2005.1569258
Title: Integrated metrology and processes for semiconductor manufacturing
Authors: Ho, W.K. 
Tay, A. 
Lim, K.W.
Loh, A.P. 
Tan, W.W. 
Issue Date: 2005
Source: Ho, W.K.,Tay, A.,Lim, K.W.,Loh, A.P.,Tan, W.W. (2005). Integrated metrology and processes for semiconductor manufacturing. IECON Proceedings (Industrial Electronics Conference) 2005 : 2278-2281. ScholarBank@NUS Repository. https://doi.org/10.1109/IECON.2005.1569258
Abstract: The 2003 International Technology Road map for Semiconductors, stated under the Section Grand Challenges that real-time in-situ, integrated, and in-line metrology is required for manufacturing. The 2003 report of the international panel on future directions in control, dynamics and systems has identified that the use of control is critical to future progress in the semiconductor sectors. Modeling plays a crucial role and control techniques must make use of increase in-situ measurements to control at a variety of temporal and spatial scales. This paper gives two examples of research on integrated metrology and processes that address some of the challenges. An integrated bake/chill/spin module and in-situ metrology for photoresist thickness will be discussed. © 2005 IEEE.
Source Title: IECON Proceedings (Industrial Electronics Conference)
URI: http://scholarbank.nus.edu.sg/handle/10635/70621
ISBN: 0780392523
DOI: 10.1109/IECON.2005.1569258
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