Please use this identifier to cite or link to this item: https://doi.org/10.1109/IMTC.2004.1351183
DC FieldValue
dc.titleIn-situ measurement & control of photoresist development in microlithography
dc.contributor.authorKiew, C.M.
dc.contributor.authorTay, A.
dc.contributor.authorHo, W.K.
dc.contributor.authorLim, K.W.
dc.contributor.authorZhou, Y.
dc.date.accessioned2014-06-19T03:14:07Z
dc.date.available2014-06-19T03:14:07Z
dc.date.issued2005
dc.identifier.citationKiew, C.M.,Tay, A.,Ho, W.K.,Lim, K.W.,Zhou, Y. (2005). In-situ measurement &amp; control of photoresist development in microlithography. Conference Record - IEEE Instrumentation and Measurement Technology Conference 2 : 803-808. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/IMTC.2004.1351183" target="_blank">https://doi.org/10.1109/IMTC.2004.1351183</a>
dc.identifier.isbn078038248X
dc.identifier.issn10915281
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/70608
dc.description.abstractMicrolithography is the key enabling technology in semi-conductor manufacturing that continued to advance in order to reduce line width, feature size and critical dimension (CD) to meet the ever-growing demand for more devices to be built on an IC Chip. Due to various non-uniformities arises from previous steps, the time to reach endpoint for a develop step may vary. This paper presents a novel approach to control photoresist development process by controlling develop temperature. It has been known that develop temperature has direct influence over the develop rate. Thin photoresist film thickness can be estimated by using a Lookup Table Referencing Technique, which involves analyzing reflected light intensities acquired using commercial available optical spectrometry system. With these, a simple Proportional-Integral (PI) controller is designed to eradicate any non-uniformities that may exist prior develop step. From the experimental results, it was found that tracking of a reference develop trend is feasible. In addition to that, the standard deviation for the time to reach endpoint has also been reduced by 4 times, from 18.87 to 4.68 when the PI controller is used. © 2005 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/IMTC.2004.1351183
dc.sourceScopus
dc.subjectMicrolithography
dc.subjectPhotoresist development
dc.subjectSemiconductor manufacturing
dc.subjectTemperature control
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/IMTC.2004.1351183
dc.description.sourcetitleConference Record - IEEE Instrumentation and Measurement Technology Conference
dc.description.volume2
dc.description.page803-808
dc.description.codenCRIIE
dc.identifier.isiutNOT_IN_WOS
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