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https://scholarbank.nus.edu.sg/handle/10635/70533
DC Field | Value | |
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dc.title | Impact of buried capping layer on TDDB physics of advanced interconnects | |
dc.contributor.author | Yiang, K.Y. | |
dc.contributor.author | Yoo, W.J. | |
dc.contributor.author | Krishnamoorthy, A. | |
dc.contributor.author | Tang, L.J. | |
dc.date.accessioned | 2014-06-19T03:13:14Z | |
dc.date.available | 2014-06-19T03:13:14Z | |
dc.date.issued | 2005 | |
dc.identifier.citation | Yiang, K.Y.,Yoo, W.J.,Krishnamoorthy, A.,Tang, L.J. (2005). Impact of buried capping layer on TDDB physics of advanced interconnects. IEEE International Reliability Physics Symposium Proceedings : 490-494. ScholarBank@NUS Repository. | |
dc.identifier.isbn | 0780388038 | |
dc.identifier.issn | 15417026 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/70533 | |
dc.description.abstract | In Cu/SiOC interconnects, the incorporation of a thin (100-Å) buried capping layer (BCL) extends the lifetime beyond 10 years when extrapolated to the operating conditions of 105°C and 0.5 MV/cm. A thicker (800-Å) BCL, however, initiates Ta barrier rupture due to thermomechanical stress and degrades lifetime performance. For the first time, three distinctively different failure mechanisms of structures with and without BCL are identified: Cu drift into the bulk SiOC, along the capping layer/SiOC interface and through the ruptured Ta barrier into the BCL. We demonstrate that BCL engineering is a realizable and potentially promising technique to improve the electrical reliability of advanced interconnects. © 2005 IEEE. | |
dc.source | Scopus | |
dc.subject | Buried capping layer | |
dc.subject | Interconnects | |
dc.subject | Low-k | |
dc.subject | Reliability | |
dc.subject | Time-dependent dielectric breakdown | |
dc.type | Conference Paper | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.sourcetitle | IEEE International Reliability Physics Symposium Proceedings | |
dc.description.page | 490-494 | |
dc.identifier.isiut | NOT_IN_WOS | |
Appears in Collections: | Staff Publications |
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