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https://scholarbank.nus.edu.sg/handle/10635/70183
DC Field | Value | |
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dc.title | Enhanced pixel by pixel emissivity correction for thermal microscopy | |
dc.contributor.author | Goh, S.H. | |
dc.contributor.author | Yim, K.H. | |
dc.contributor.author | Phang, J.C.H. | |
dc.contributor.author | Balk, L.J. | |
dc.date.accessioned | 2014-06-19T03:09:12Z | |
dc.date.available | 2014-06-19T03:09:12Z | |
dc.date.issued | 2004 | |
dc.identifier.citation | Goh, S.H.,Yim, K.H.,Phang, J.C.H.,Balk, L.J. (2004). Enhanced pixel by pixel emissivity correction for thermal microscopy. Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004 : 451-456. ScholarBank@NUS Repository. | |
dc.identifier.isbn | 0871708078 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/70183 | |
dc.description.abstract | In thermal microscopy, temperature error arises whenever a constant emissivity value is assumed for different materials. In this paper, we propose a new approach to eliminate these undesirable effects resulting from the ambiguous surface emissivity of materials. This method enables the compensated (true) temperature distribution of a device under test to be obtained from the measured temperature image. A transfer function that relates the measured and true temperature is formed to estimate the actual temperature distribution of a biased device to an accuracy of approximately 0.3-0.7K. | |
dc.source | Scopus | |
dc.type | Conference Paper | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.sourcetitle | Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004 | |
dc.description.page | 451-456 | |
dc.identifier.isiut | NOT_IN_WOS | |
Appears in Collections: | Staff Publications |
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