Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPEP.2008.4675886
Title: Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package
Authors: Oo, Z.Z.
Wei, X.-C.
Liu, E.-X.
Li, E.-P. 
Li, L.-W. 
Issue Date: 2008
Source: Oo, Z.Z.,Wei, X.-C.,Liu, E.-X.,Li, E.-P.,Li, L.-W. (2008). Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package. Electrical Performance of Electronic Packaging, EPEP : 95-98. ScholarBank@NUS Repository. https://doi.org/10.1109/EPEP.2008.4675886
Abstract: Efficient modeling method is presented for analysis of multilayer power-ground planes with multiple vias coupled to signal traces in an electronic package. A key feature of the proposed method is that applying modal decoupling in power distribution network (PDN) of the package to extract equivalent network parameters. The method has been experimentally validated and examined. © 2008 IEEE.
Source Title: Electrical Performance of Electronic Packaging, EPEP
URI: http://scholarbank.nus.edu.sg/handle/10635/70100
ISBN: 9781424428731
DOI: 10.1109/EPEP.2008.4675886
Appears in Collections:Staff Publications

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