Please use this identifier to cite or link to this item:
|Title:||Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package|
|Citation:||Oo, Z.Z.,Wei, X.-C.,Liu, E.-X.,Li, E.-P.,Li, L.-W. (2008). Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package. Electrical Performance of Electronic Packaging, EPEP : 95-98. ScholarBank@NUS Repository. https://doi.org/10.1109/EPEP.2008.4675886|
|Abstract:||Efficient modeling method is presented for analysis of multilayer power-ground planes with multiple vias coupled to signal traces in an electronic package. A key feature of the proposed method is that applying modal decoupling in power distribution network (PDN) of the package to extract equivalent network parameters. The method has been experimentally validated and examined. © 2008 IEEE.|
|Source Title:||Electrical Performance of Electronic Packaging, EPEP|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Nov 16, 2018
checked on Nov 3, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.