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|Title:||Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds|
|Citation:||Made, R.I.,Gan, C.L.,Lee, C.,Yan, L.,Yu, A.,Yoon, S.W. (2008). Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA : -. ScholarBank@NUS Repository. https://doi.org/10.1109/IPFA.2008.4588168|
|Abstract:||Bonding of multiple indium-silver intermediate layers facilitates precise control of the formed alloy composition and the joint thickness. The bonding temperature and post-bonding re-melting temperature can thus be easily designed by controlling the multilayer materials and structure thicknesses. However, joining different materials involves the formation of intermetallics, which is known to be brittle. In this paper, In-Ag intermetallic phase formation under different applied pressure is studied.|
|Source Title:||Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA|
|Appears in Collections:||Staff Publications|
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