Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/69892
Title: Detection of Wafer warpages during thermal processing in microlithography
Authors: Ho, W.K. 
Tay, A. 
Zhou, Y.
Yang, K.
Hu, N.
Keywords: Fault Detection
Microlithography
Temperature Measurement
Wafer Warpage
Issue Date: 2004
Source: Ho, W.K.,Tay, A.,Zhou, Y.,Yang, K.,Hu, N. (2004). Detection of Wafer warpages during thermal processing in microlithography. 2004 8th International Conference on Control, Automation, Robotics and Vision (ICARCV) 1 : 485-490. ScholarBank@NUS Repository.
Abstract: Wafer warpage is common in microelectronics processing. Warped wafers can affect device performance, reliability and linewidth control in various processing steps. We proposed in this paper an insitu fault detection technique for wafer warpage in micro lithography. Early detection will minimize cost and processing time. Based on first principle thermal modeling, we are able to detect warpage fault from available temperature measurements. Experimental results demonstrate the feasibility of the approach. The proposed approach is applicable to other semiconductor substrates. © 2004 IEEE.
Source Title: 2004 8th International Conference on Control, Automation, Robotics and Vision (ICARCV)
URI: http://scholarbank.nus.edu.sg/handle/10635/69892
ISBN: 0780386531
Appears in Collections:Staff Publications

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