Please use this identifier to cite or link to this item: https://doi.org/10.1109/IECON.2003.1280565
Title: Control of Photoresist Thickness Uniformity in the Microlithography Process
Authors: Tay, A. 
Keywords: Photoresist Processing
Photoresist Thickness Uniformity
Semiconductor Manufacturing
Temperature Control
Issue Date: 2003
Citation: Tay, A. (2003). Control of Photoresist Thickness Uniformity in the Microlithography Process. IECON Proceedings (Industrial Electronics Conference) 3 : 2091-2096. ScholarBank@NUS Repository. https://doi.org/10.1109/IECON.2003.1280565
Abstract: A novel approach to improve photoresist thickness uniformity after the conventional spin-coating and softbake process is proposed in this paper. Using an array of thickness sensors, a multizone programmable bakeplate, and standard PI controller, the temperature distribution of the bakeplate is manipulated in real-time to reduce photoresist thickness nonuniformity. We have experimentally obtained a repeatable improvement in resist thickness uniformity from wafer-to-wafer and across each wafer. Thickness nonuniformity of less than 10 nm has been obtained. On average, there is a 10× improvement in the thickness uniformity as compared to conventional softbake process.
Source Title: IECON Proceedings (Industrial Electronics Conference)
URI: http://scholarbank.nus.edu.sg/handle/10635/69731
DOI: 10.1109/IECON.2003.1280565
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