Please use this identifier to cite or link to this item: https://doi.org/10.4028/0-87849-471-5.227
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dc.titleAnnihilation of threading dislocations in regrown GaN on electrochemically etched nanoporous GaN template with optimization of buffer layer growth
dc.contributor.authorSoh, C.B.
dc.contributor.authorHartono, H.
dc.contributor.authorChow, S.Y.
dc.contributor.authorChua, S.J.
dc.date.accessioned2014-06-19T03:00:27Z
dc.date.available2014-06-19T03:00:27Z
dc.date.issued2008
dc.identifier.citationSoh, C.B.,Hartono, H.,Chow, S.Y.,Chua, S.J. (2008). Annihilation of threading dislocations in regrown GaN on electrochemically etched nanoporous GaN template with optimization of buffer layer growth. Advanced Materials Research 31 : 227-229. ScholarBank@NUS Repository. <a href="https://doi.org/10.4028/0-87849-471-5.227" target="_blank">https://doi.org/10.4028/0-87849-471-5.227</a>
dc.identifier.isbn0878494715
dc.identifier.issn10226680
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/69418
dc.description.abstractNanoporous GaN template has been fabricated by electrochemical etching to give hexagonal pits with nano-scale pores of size 20-50 nm in the underlying grains. Electrochemical etching at The effect of GaN buffer layer grown at various temperatures from 650°C to 1015°C on these as-fabricated nano-pores templates are investigated by transmission electron microscopy. The buffer layer grown at the optimized temperature of 850°C partially fill up the pores and voids with annihilation of threading dislocations, serving as an excellent template for high-quality GaN growth. This phenomenon is, however not observed for the samples grown with other temperature buffer layers. The PL spectrum for the regrowth GaN on nanoporous GaN template also shows an enhancement of PL intensity for GaN peak compared to as-grown GaN template, which is indicative of its higher crystal quality. This makes it as a suitable template for subsequent device fabrication.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.4028/0-87849-471-5.227
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.4028/0-87849-471-5.227
dc.description.sourcetitleAdvanced Materials Research
dc.description.volume31
dc.description.page227-229
dc.identifier.isiutNOT_IN_WOS
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