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|Title:||Analysis of leakage mechanisms and leakage pathways in intra-level Cu interconnects|
LOW-k and Copper
|Source:||Ngwan, V.C.,Zhu, C.,Krishnamoorthy, A. (2004). Analysis of leakage mechanisms and leakage pathways in intra-level Cu interconnects. Annual Proceedings - Reliability Physics (Symposium) : 571-572. ScholarBank@NUS Repository.|
|Abstract:||Using the carrier transport modeling in intra-level Cu interconnects, we are able to distinguish the dominant leakage mechanisms: Ohmic, Poole-Frenkel and Schottky mechanisms. In addition, the probable dominant leakage pathways: bulk-induced, barrier layer-induced or their interfaces-induced pathways are deduced to explain the leakage behavior in multilayer interconnects.|
|Source Title:||Annual Proceedings - Reliability Physics (Symposium)|
|Appears in Collections:||Staff Publications|
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