Please use this identifier to cite or link to this item:
Title: An efficient method for power integrity and EMI analysis of advanced packages
Authors: Liu, E.-X.
Wei, X.
Oo, Z.Z.
Li, E.-P. 
Issue Date: 2008
Citation: Liu, E.-X., Wei, X., Oo, Z.Z., Li, E.-P. (2008). An efficient method for power integrity and EMI analysis of advanced packages. Proceedings - Electronic Components and Technology Conference : 652-657. ScholarBank@NUS Repository.
Abstract: A two-dimensional full-wave method is presented in this paper for efficient power integrity and EMI Analysis of high-speed electronic packages. The power/ground planes in electronic packages form a parallel-plate structure, which is solved by a 2D finite-different time domain (2D FDTD) method. Both the conductor loss and the substrate loss are modeled by the 2D method. Besides the parallel-plate structure, electronic packages also comprise of many transmission lines including microstrip- and stripline-type structures. Those two types of structures are also resolved by the 2D method. So a unified solver may be developed in the context of 2D method for the signal and power integrity analysis of electronic packages. The electromagnetic interference (EMI) issue of electronic packages is also touched in this paper, which is mainly focused on the radiation due to the edge effect of the parallel plate structure in a package. Numerical examples are given to demonstrate the method. © 2008 IEEE.
Source Title: Proceedings - Electronic Components and Technology Conference
ISBN: 9781424422302
ISSN: 05695503
DOI: 10.1109/ECTC.2008.4550041
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.


checked on Feb 11, 2019


checked on Feb 11, 2019

Page view(s)

checked on Feb 2, 2019

Google ScholarTM



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.