Please use this identifier to cite or link to this item: https://doi.org/10.1149/1.3203967
Title: Advanced contact technology for MOSFETs: Integration of new materials for series resistance reduction
Authors: Yeo, Y.-C. 
Lee, R.T.-P. 
Issue Date: 2009
Source: Yeo, Y.-C., Lee, R.T.-P. (2009). Advanced contact technology for MOSFETs: Integration of new materials for series resistance reduction. ECS Transactions 25 (7) : 291-302. ScholarBank@NUS Repository. https://doi.org/10.1149/1.3203967
Abstract: In this paper, new technology solutions for reducing contact resistance to enhance MOSFET drive current performance are discussed. We focus on several new approaches pioneered by our group for reducing electron and hole barrier heights between the heavily-doped diffusion region and the suicide layer in n-FET and p-FET, respectively. Integration of these approaches in advanced device architectures would contribute to the realization of high-performance CMOS devices. © The Electrochemical Society.
Source Title: ECS Transactions
URI: http://scholarbank.nus.edu.sg/handle/10635/69238
ISBN: 9781566777445
ISSN: 19385862
DOI: 10.1149/1.3203967
Appears in Collections:Staff Publications

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