Please use this identifier to cite or link to this item:
|Title:||A wideband scalable and SPICE-compatible model for on-chip interconnects up to 80 GHz|
|Source:||Kang, K., Nan, L., Rustagi, S.C., Mouthaan, K., Shi, J., Kumar, R., Li, L.-W. (2007). A wideband scalable and SPICE-compatible model for on-chip interconnects up to 80 GHz. Digest of Papers - IEEE Radio Frequency Integrated Circuits Symposium : 291-294. ScholarBank@NUS Repository. https://doi.org/10.1109/RFIC.2007.380885|
|Abstract:||A fully scalable and SPICE compatible wide band model up to 80 GHz of on-chip interconnects is presented in this paper. The series branch of the proposed model consists of an RL ladder network to characterize the skin and proximity effects as well as substrate skin effect Their values are obtained from a technique based on a modified effective loop inductance model and complex image method. A CG network is used as the shunt branch of the model, which accounts for capacitive coupling through the oxide and substrate loss due to the electrical field. The values of these elements are determined by analytical formulas. The model is validated by both full-wave simulation and measurements. The simulated S-parameters of the model agree well with the measured S-parameters of on-chip interconnects with different widths and lengths over a wide frequency band from DC up to 80 GHz. © 2007 IEEE.|
|Source Title:||Digest of Papers - IEEE Radio Frequency Integrated Circuits Symposium|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jan 22, 2018
WEB OF SCIENCETM
checked on Nov 18, 2017
checked on Jan 19, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.