Please use this identifier to cite or link to this item: https://doi.org/10.1109/RFIC.2007.380885
Title: A wideband scalable and SPICE-compatible model for on-chip interconnects up to 80 GHz
Authors: Kang, K.
Nan, L.
Rustagi, S.C.
Mouthaan, K. 
Shi, J.
Kumar, R.
Li, L.-W. 
Keywords: Interconnects
Model
On-chip
Scalable
SPICE-compatible
Wide band
Issue Date: 2007
Source: Kang, K., Nan, L., Rustagi, S.C., Mouthaan, K., Shi, J., Kumar, R., Li, L.-W. (2007). A wideband scalable and SPICE-compatible model for on-chip interconnects up to 80 GHz. Digest of Papers - IEEE Radio Frequency Integrated Circuits Symposium : 291-294. ScholarBank@NUS Repository. https://doi.org/10.1109/RFIC.2007.380885
Abstract: A fully scalable and SPICE compatible wide band model up to 80 GHz of on-chip interconnects is presented in this paper. The series branch of the proposed model consists of an RL ladder network to characterize the skin and proximity effects as well as substrate skin effect Their values are obtained from a technique based on a modified effective loop inductance model and complex image method. A CG network is used as the shunt branch of the model, which accounts for capacitive coupling through the oxide and substrate loss due to the electrical field. The values of these elements are determined by analytical formulas. The model is validated by both full-wave simulation and measurements. The simulated S-parameters of the model agree well with the measured S-parameters of on-chip interconnects with different widths and lengths over a wide frequency band from DC up to 80 GHz. © 2007 IEEE.
Source Title: Digest of Papers - IEEE Radio Frequency Integrated Circuits Symposium
URI: http://scholarbank.nus.edu.sg/handle/10635/69132
ISBN: 1424405319
ISSN: 15292517
DOI: 10.1109/RFIC.2007.380885
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