Please use this identifier to cite or link to this item:
|Title:||A systematic semi-numerical approach for modeling of signal and power integrity of electronic packages|
|Authors:||Li, E.-P. |
|Source:||Li, E.-P.,Liu, E.-X.,Oo, Z.Z.,Wei, X.,Zhang, Y.,Vahldieck, R. (2007). A systematic semi-numerical approach for modeling of signal and power integrity of electronic packages. IEEE International Symposium on Electromagnetic Compatibility : -. ScholarBank@NUS Repository. https://doi.org/10.1109/ISEMC.2007.188|
|Abstract:||A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages. The method is a semi-numerical approach based on the combination of the moment method and the scattering matrix method. © 2007 IEEE.|
|Source Title:||IEEE International Symposium on Electromagnetic Compatibility|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Dec 13, 2017
checked on Dec 9, 2017
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.