Please use this identifier to cite or link to this item: https://doi.org/10.1109/ISEMC.2007.188
Title: A systematic semi-numerical approach for modeling of signal and power integrity of electronic packages
Authors: Li, E.-P. 
Liu, E.-X.
Oo, Z.Z.
Wei, X.
Zhang, Y.
Vahldieck, R.
Keywords: Electronic package
Power integrity
Signal integrity
System-level modeling
Issue Date: 2007
Source: Li, E.-P.,Liu, E.-X.,Oo, Z.Z.,Wei, X.,Zhang, Y.,Vahldieck, R. (2007). A systematic semi-numerical approach for modeling of signal and power integrity of electronic packages. IEEE International Symposium on Electromagnetic Compatibility : -. ScholarBank@NUS Repository. https://doi.org/10.1109/ISEMC.2007.188
Abstract: A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages. The method is a semi-numerical approach based on the combination of the moment method and the scattering matrix method. © 2007 IEEE.
Source Title: IEEE International Symposium on Electromagnetic Compatibility
URI: http://scholarbank.nus.edu.sg/handle/10635/69102
ISBN: 1424413508
ISSN: 10774076
DOI: 10.1109/ISEMC.2007.188
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

1
checked on Dec 13, 2017

Page view(s)

32
checked on Dec 9, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.