A systematic on-wafer characterization technique for surface-mounted microwave and RF packages

Abstract

The emerging applications of wireless communications call for an effective low-cost approaches to microwave and RF packaging so as to meet the demand of the commercial market place. To ensure a good package design, development of characterization techniques for surface mounted package is thus necessary so as to predict the parasitic behavior of the package at microwave and RF frequencies. There is very little report on characterizing multi-conductor leads, most especially, the coupling effect between near neighboring pins of the microwave and RF packages. In this paper, a systematic approach of on-wafer characterization of a TSSOP package is demonstrated. For the first time, a whole series of novel coplanar package adapters for multi-conductors characterization is designed.