Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/69101
Title: A systematic on-wafer characterization technique for surface-mounted microwave and RF packages
Authors: Ooi, B.L. 
Qiu, Y.L.
Leong, M.S. 
Soe, M.M.
Keywords: Multi-line Calibration
Reciprocity Condition
Issue Date: 2001
Source: Ooi, B.L.,Qiu, Y.L.,Leong, M.S.,Soe, M.M. (2001). A systematic on-wafer characterization technique for surface-mounted microwave and RF packages. Advances in Electronic Packaging 1 : 45-48. ScholarBank@NUS Repository.
Abstract: The emerging applications of wireless communications call for an effective low-cost approaches to microwave and RF packaging so as to meet the demand of the commercial market place. To ensure a good package design, development of characterization techniques for surface mounted package is thus necessary so as to predict the parasitic behavior of the package at microwave and RF frequencies. There is very little report on characterizing multi-conductor leads, most especially, the coupling effect between near neighboring pins of the microwave and RF packages. In this paper, a systematic approach of on-wafer characterization of a TSSOP package is demonstrated. For the first time, a whole series of novel coplanar package adapters for multi-conductors characterization is designed.
Source Title: Advances in Electronic Packaging
URI: http://scholarbank.nus.edu.sg/handle/10635/69101
ISBN: 0791835405
Appears in Collections:Staff Publications

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