Please use this identifier to cite or link to this item: https://doi.org/10.1109/ECTC.2010.5490761
Title: 3D TSV transformer design for DC-DC/AC-DC converter
Authors: Zhang, B.
Xiong, Y.-Z.
Wang, L.
Hu, S.
Shi, J.
Zhuang, Y.-Q.
Li, L.-W. 
Yuan, X.
Issue Date: 2010
Citation: Zhang, B., Xiong, Y.-Z., Wang, L., Hu, S., Shi, J., Zhuang, Y.-Q., Li, L.-W., Yuan, X. (2010). 3D TSV transformer design for DC-DC/AC-DC converter. Proceedings - Electronic Components and Technology Conference : 1653-1656. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2010.5490761
Abstract: This paper presents a new concept of 3D transformer structure realized by through silicon via (TSV) technology. A set of different turn ratio transformers have been designed and analyzed. The results show that the proposed 3D TSV transformer possesses good performance with small size. Finally, an AC to DC converter circuit which based on proposed transformer has been designed. The result demonstrates that proposed 3D TSV transformer is suitable for AC to DC converter design. © 2010 IEEE.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/68683
ISBN: 9781424464104
ISSN: 05695503
DOI: 10.1109/ECTC.2010.5490761
Appears in Collections:Staff Publications

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