Please use this identifier to cite or link to this item: https://doi.org/10.1109/LED.2002.805748
Title: A concise process technology for 3-D suspended radio frequency micro-inductors on silicon substrate
Authors: Liang, Y.C. 
Zeng, W.
Ong, P.H.
Gao, Z.
Cai, J.
Balasubramanian, N.
Keywords: Micro-electrical-mechanical systems (MEMS)
Micro-inductor
Radio frequency integrated circuit (RFIC)
System on a chip (SOC)
Issue Date: Dec-2002
Source: Liang, Y.C., Zeng, W., Ong, P.H., Gao, Z., Cai, J., Balasubramanian, N. (2002-12). A concise process technology for 3-D suspended radio frequency micro-inductors on silicon substrate. IEEE Electron Device Letters 23 (12) : 700-703. ScholarBank@NUS Repository. https://doi.org/10.1109/LED.2002.805748
Abstract: In this letter, a concise process technology is proposed for the first time to enable the fabrication of good quality three-dimensional (3-D) suspended radio frequency (RF) micro-inductors on bulk silicon, without utilizing the lithography process on sidewall and trench-bottom patterning. Samples were fabricated to demonstrate the applicability of the proposed process technology.
Source Title: IEEE Electron Device Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/67818
ISSN: 07413106
DOI: 10.1109/LED.2002.805748
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