Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.msea.2006.01.040
Title: Atomistic simulations of mechanical deformation of high-angle and low-angle nanocrystalline copper at room temperature
Authors: Zheng, C.
Zhang, Y.W. 
Keywords: Copper
Molecular dynamics
Nanocrystalline materials
Plastic deformation
Issue Date: 15-May-2006
Source: Zheng, C., Zhang, Y.W. (2006-05-15). Atomistic simulations of mechanical deformation of high-angle and low-angle nanocrystalline copper at room temperature. Materials Science and Engineering A 423 (1-2) : 97-101. ScholarBank@NUS Repository. https://doi.org/10.1016/j.msea.2006.01.040
Abstract: Molecular dynamics simulations were performed to study the mechanical behavior of high-angle and low-angle nanocrystalline copper with the average grain size in the range of 3.7-6.7 nm at room temperature. Atomic configuration analysis indicates that the grain boundary sliding is the main deformation mechanism in the high-angle samples while both dislocation motion and grain boundary activities play an important role in the plastic deformation for low-angle (textured) samples. The grain boundary activities in the low-angle samples are manifested by migration, breakup and dislocation activities within grain boundaries themselves. It was found that the orientation of the grains to the tensile direction strongly affects the mechanical behavior of the textured samples. © 2006 Elsevier B.V. All rights reserved.
Source Title: Materials Science and Engineering A
URI: http://scholarbank.nus.edu.sg/handle/10635/64815
ISSN: 09215093
DOI: 10.1016/j.msea.2006.01.040
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