Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.matlet.2004.08.001
Title: New approach to nanocomposites of polyimides containing polyhedral oligomeric silsesquioxane for dielectric applications
Authors: Chen, Y.
Kang, E.-T. 
Keywords: Dielectrics
Graft polymerization
Nanocomposites
Polyimide
POSS
Issue Date: Nov-2004
Source: Chen, Y., Kang, E.-T. (2004-11). New approach to nanocomposites of polyimides containing polyhedral oligomeric silsesquioxane for dielectric applications. Materials Letters 58 (29) : 3716-3719. ScholarBank@NUS Repository. https://doi.org/10.1016/j.matlet.2004.08.001
Abstract: Low dielectric constant nanocomposites of polyimides with grafted methacrylate side chains containing polyhedral oligomeric silsesquioxane (POSS) were successfully synthesized by thermally initiated free-radical graft copolymerization of methacrylcyclopentyl-POSS (MA-POSS) with the ozone-preactivated poly(amic acid), followed by thermal imidization. The dielectric constant of the film can be tuned by varying the molar ratio of the grafted MA-POSS side chains in the copolymer. © 2004 Elsevier B.V. All rights reserved.
Source Title: Materials Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/64289
ISSN: 0167577X
DOI: 10.1016/j.matlet.2004.08.001
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