Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2004.11.192
Title: Cross-linked polyimide - Polythiophene composite films with reduced surface resistivities
Authors: Zhang, F.
Srinivasan, M.P. 
Keywords: Crosslinking
Multilayers
Polymers
Surface resistivity
Issue Date: 23-May-2005
Source: Zhang, F., Srinivasan, M.P. (2005-05-23). Cross-linked polyimide - Polythiophene composite films with reduced surface resistivities. Thin Solid Films 479 (1-2) : 95-102. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2004.11.192
Abstract: Composite polyimide thin films with reduced surface resistivities were prepared using preformed and soluble hydroxyl polyimide (HPI) and polythiophene acetic acid (PTAA). Casting of blends and layer-by-layer assembly were employed to fabricate the thin films. In either technique, HPI and PTAA chains are cross-linked through ester formation, giving rise to thermal and mechanical robustness. Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy and Ultraviolet-visible absorption spectroscopy were used to investigate the formation of the composite films. Surface resistivity measurements showed that the values were well-suited for antistatic applications. The composite structures also showed good stability to thermal and ambient environments. © 2004 Elsevier B.V. All rights reserved.
Source Title: Thin Solid Films
URI: http://scholarbank.nus.edu.sg/handle/10635/63679
ISSN: 00406090
DOI: 10.1016/j.tsf.2004.11.192
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