Please use this identifier to cite or link to this item: https://doi.org/10.1002/ima.1010
Title: A stereo vision system for the inspection of IC bonding wires
Authors: Ye, Q.Z. 
Ong, S.H. 
Han, X.
Keywords: 3D inspection
Curve matching
Stereo vision
Wire bond inspection
Issue Date: 2000
Source: Ye, Q.Z., Ong, S.H., Han, X. (2000). A stereo vision system for the inspection of IC bonding wires. International Journal of Imaging Systems and Technology 11 (4) : 254-262. ScholarBank@NUS Repository. https://doi.org/10.1002/ima.1010
Abstract: We describe a novel inspection system based on the application of the stereo technique to the detection of defects related to the three-dimensional (3D) profile of IC wire bonds. In our single-camera-based setup, stereo views are obtained by rotating the IC chip under the CCD camera with a telecentric lens. The edges of the wires are detected using Petrou's line filter and the facet model applied to obtain subpixel edge localization. After linking edges to form meaningful curves, stereo matching is conducted between the two curve lists of a stereo pair. The height profiles of the wire bonds are obtained using the disparity equation derived from the imaging geometry. © 2001 John Wiley & Sons, Inc.
Source Title: International Journal of Imaging Systems and Technology
URI: http://scholarbank.nus.edu.sg/handle/10635/61718
ISSN: 08999457
DOI: 10.1002/ima.1010
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