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|Title:||Understanding nitrogen-induced effects on the performance of ultra low-k dielectric systems through ab initio simulations|
|Authors:||Dai, L. |
|Citation:||Dai, L., Tan, V.B.C., Yang, S.-W., Wu, P., Chen, X.-T. (2007-08-15). Understanding nitrogen-induced effects on the performance of ultra low-k dielectric systems through ab initio simulations. Surface Science 601 (16) : 3366-3371. ScholarBank@NUS Repository. https://doi.org/10.1016/j.susc.2007.06.025|
|Abstract:||Large scale ab initio molecular dynamics simulations were performed to investigate how Cu/ultra low-k systems are improved when N is incorporated into the pore-sealing layers. It was found that the high affinity of N to Ta and H gives rise to new phases that prevent H atoms from penetrating the Ta diffusion barrier layer. Consequently, the Ta layer forms organized structures with good barrier performance and electrical conductivity. Furthermore, a continuous ductile film is formed to seal the highly porous polymer dielectrics. Interfacial adhesion between the pore-sealing layer and the dielectrics is also enhanced by inter-diffusion. © 2007 Elsevier B.V. All rights reserved.|
|Source Title:||Surface Science|
|Appears in Collections:||Staff Publications|
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