Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.wear.2004.12.020
Title: Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
Authors: Li, X.P. 
He, T.
Rahman, M. 
Keywords: Ductile mode cutting
Nanoscale
Silicon wafer
Tool wear
Issue Date: Aug-2005
Source: Li, X.P., He, T., Rahman, M. (2005-08). Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer. Wear 259 (7-12) : 1207-1214. ScholarBank@NUS Repository. https://doi.org/10.1016/j.wear.2004.12.020
Abstract: Nanoscale ductile mode cutting of single crystalline silicon is a very promising technology for fracture free machining of silicon wafers. In the technology, the tool edge radius is required to on nanoscale for the ductile chip formation mode. Therefore, one of the main concerns with the implementation of such a technology is the tool wear and its effect on chip formation mode. In this study, the variation of tool geometry due to tool wear and its influence on the nanoscale ductile mode cutting of silicon wafer with single crystalline diamond tools is investigated and analyzed. The tool shape and cutting edge radius before and after cutting are measured using a non-destructive nano-indentation method. Variations of the cutting forces with tool wear during cutting are also investigated. It is found that the tool cutting edges undergo two processes simultaneously. One is the wear of material on the tool main cutting edge, which increases the main cutting edge radius, but leaves the shape of the main cutting edge unchanged, enhancing the conditions for ductile mode chip formation. The other one is the generation of nano or micro grooves at the tool flank, which forms sub-cutting edges of much smaller radii on the main cutting edge. As the grooves become deeper and deeper, the sub-cutting edges extend towards the tool rake face ultimately becoming the dominating cutting edge of much smaller radius. In such a way these sub-cutting edges tend to change the cutting mode from ductile to brittle. © 2005 Elsevier B.V. All rights reserved.
Source Title: Wear
URI: http://scholarbank.nus.edu.sg/handle/10635/61590
ISSN: 00431648
DOI: 10.1016/j.wear.2004.12.020
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

38
checked on Apr 10, 2018

WEB OF SCIENCETM
Citations

32
checked on Apr 10, 2018

Page view(s)

29
checked on Mar 11, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.