Please use this identifier to cite or link to this item: https://doi.org/10.1109/TCAPT.2008.2004602
Title: Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects
Authors: Cheong, W.G.
Chew, H.B.
Guo, T.F. 
Cheng, L. 
Keywords: Finite-element analysis
Interfacial adhesion
Micromechanical damage
Moisture sensitivity
Package reliability
Issue Date: 2009
Source: Cheong, W.G., Chew, H.B., Guo, T.F., Cheng, L. (2009). Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects. IEEE Transactions on Components and Packaging Technologies 32 (1) : 12-19. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2008.2004602
Abstract: This study adopts a mechanism-based computational approach to gain insights into the delamination and cracking of plastic ball grid array (PBGA) packages under moisture sensitivity test (MST) conditions. The possible crack paths in the molding compound are first examined by modeling the fully porous overmold with void-containing cell elements. These computational cells are governed by a Gurson constitutive relation, extended to account for vapor pressure effects. We show that the corner of the die/die-attach interface presents a likely site for crack initiation under MST conditions. Failure along this interface of interest is then examined by deploying a single row of computational cells along the die/die-attach interface. Under combined thermal and vapor pressure loading, delamination concurrently occurs at both the die corner and the die center; these competing damage sites lead to the rapid and complete delamination of the die/die-attach interfaces. © 2009 IEEE.
Source Title: IEEE Transactions on Components and Packaging Technologies
URI: http://scholarbank.nus.edu.sg/handle/10635/61564
ISSN: 15213331
DOI: 10.1109/TCAPT.2008.2004602
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