Please use this identifier to cite or link to this item: https://doi.org/10.1007/s00170-005-0245-0
Title: The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer
Authors: Arefin, S.
Li, X.P. 
Rahman, M. 
Liu, K. 
Keywords: Cutting edge radius
Ductile mode cutting
Nanoscale
Silicon wafer
Issue Date: Jan-2007
Citation: Arefin, S., Li, X.P., Rahman, M., Liu, K. (2007-01). The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer. International Journal of Advanced Manufacturing Technology 31 (7-8) : 655-662. ScholarBank@NUS Repository. https://doi.org/10.1007/s00170-005-0245-0
Abstract: For ductile mode cutting of brittle materials, such as silicon wafers, the undeformed chip thickness has to be smaller than the tool edge radius. In practical application, for high production rate, the undeformed chip thickness is expected to be as large as possible. Therefore, the tool edge radius is expected to be as large as possible. In this study, the upper bound of the tool edge radius is investigated through cutting experiments. © Springer-Verlag London Limited 2007.
Source Title: International Journal of Advanced Manufacturing Technology
URI: http://scholarbank.nus.edu.sg/handle/10635/61533
ISSN: 02683768
DOI: 10.1007/s00170-005-0245-0
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