Please use this identifier to cite or link to this item: https://doi.org/10.1007/s11665-011-0083-1
Title: Study of the diffusion of carbon, its sources, and effect on finishing micro-EDM performance of cemented carbide
Authors: Jahan, M.P.
Rahman, M. 
Wong, Y.S. 
Keywords: carbon diffusion
materials' transfer
micro-EDM
surface defect
WC-Co
Issue Date: Aug-2012
Source: Jahan, M.P., Rahman, M., Wong, Y.S. (2012-08). Study of the diffusion of carbon, its sources, and effect on finishing micro-EDM performance of cemented carbide. Journal of Materials Engineering and Performance 21 (8) : 1655-1668. ScholarBank@NUS Repository. https://doi.org/10.1007/s11665-011-0083-1
Abstract: Apart from the necessity of surface modification based on different applications, in most of the cases, diffusion of carbon or foreign particles on the workpiece surface during micro-electrodischarge machining (micro-EDM) is avoidable, especially in finishing micro-EDM. This study aims to investigate different sources of materials that migrate to the machined surface during fine-finishing of micro-EDM of cemented tungsten carbide (WC-Co). The machined surfaces have been examined under scanning electron microscope and energy dispersive x-ray to investigate the changes in chemical composition. It has been observed that during finishing of micro-EDM, the major source of materials' transfer to both the workpiece and electrode is the diffusion of carbon that comes from the decomposition of the hydrocarbon dielectric. In addition, materials from both workpiece and electrode transfer to each other based on machining conditions and discharge energy. The migration occurs more frequently at lower gap voltages during die-sinking with micro-EDM because of low spark gap and stationary tool electrode. Milling micro-EDM results in lower amount of carbon migration and fewer surface defects that improve the overall surface finish significantly. © 2011 ASM International.
Source Title: Journal of Materials Engineering and Performance
URI: http://scholarbank.nus.edu.sg/handle/10635/61400
ISSN: 10599495
DOI: 10.1007/s11665-011-0083-1
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