Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.sna.2006.06.044
Title: Strategies in deep wet etching of Pyrex glass
Authors: Iliescu, C.
Tay, F.E.H. 
Miao, J.
Keywords: Masking layer
Residual stress
Wet etching of glass
Issue Date: 12-Feb-2007
Source: Iliescu, C., Tay, F.E.H., Miao, J. (2007-02-12). Strategies in deep wet etching of Pyrex glass. Sensors and Actuators, A: Physical 133 (2 SPEC. ISS.) : 395-400. ScholarBank@NUS Repository. https://doi.org/10.1016/j.sna.2006.06.044
Abstract: This paper establishes the strategies for deep wet etching of one of the most common glasses: Pyrex. There are two way for increasing the etch depth: increasing the etch rate or increasing the resistance of the mask in the etching solution. The paper analyzes the methods for increasing the glass etch rate in HF solutions: annealing, concentration, ultrasonic agitation and temperature. The generation of the defects is investigated. The main factors that affect the degradation of the mask are: type, value and gradient of the residual stress and the hydrophilicity of the surface. Cr/Au mask is used for illustration. A new method for deep wet etching of glass using Cr/Au mask and photoresist is established. The result of this method is the best thus far as reported in the literature: 85 min deep wet etching in HF 49% which is equivalent to etching of more than 500 μm deep in the Pyrex glass material. © 2006 Elsevier B.V. All rights reserved.
Source Title: Sensors and Actuators, A: Physical
URI: http://scholarbank.nus.edu.sg/handle/10635/61378
ISSN: 09244247
DOI: 10.1016/j.sna.2006.06.044
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

50
checked on Dec 5, 2017

WEB OF SCIENCETM
Citations

47
checked on Dec 5, 2017

Page view(s)

23
checked on Dec 11, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.