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Title: Strategies in deep wet etching of Pyrex glass
Authors: Iliescu, C.
Tay, F.E.H. 
Miao, J.
Keywords: Masking layer
Residual stress
Wet etching of glass
Issue Date: 12-Feb-2007
Citation: Iliescu, C., Tay, F.E.H., Miao, J. (2007-02-12). Strategies in deep wet etching of Pyrex glass. Sensors and Actuators, A: Physical 133 (2 SPEC. ISS.) : 395-400. ScholarBank@NUS Repository.
Abstract: This paper establishes the strategies for deep wet etching of one of the most common glasses: Pyrex. There are two way for increasing the etch depth: increasing the etch rate or increasing the resistance of the mask in the etching solution. The paper analyzes the methods for increasing the glass etch rate in HF solutions: annealing, concentration, ultrasonic agitation and temperature. The generation of the defects is investigated. The main factors that affect the degradation of the mask are: type, value and gradient of the residual stress and the hydrophilicity of the surface. Cr/Au mask is used for illustration. A new method for deep wet etching of glass using Cr/Au mask and photoresist is established. The result of this method is the best thus far as reported in the literature: 85 min deep wet etching in HF 49% which is equivalent to etching of more than 500 μm deep in the Pyrex glass material. © 2006 Elsevier B.V. All rights reserved.
Source Title: Sensors and Actuators, A: Physical
ISSN: 09244247
DOI: 10.1016/j.sna.2006.06.044
Appears in Collections:Staff Publications

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