Please use this identifier to cite or link to this item: https://doi.org/3/319
Title: Singular elements for electro-mechanical coupling analysis of micro-devices
Authors: Ong, E.T.
Lee, K.H. 
Lim, K.M. 
Issue Date: May-2003
Source: Ong, E.T.,Lee, K.H.,Lim, K.M. (2003-05). Singular elements for electro-mechanical coupling analysis of micro-devices. Journal of Micromechanics and Microengineering 13 (3) : 482-490. ScholarBank@NUS Repository. https://doi.org/3/319
Abstract: The boundary element method is widely used in the electrostatic analysis of micro-electro-mechanical systems (MEMS) in order to determine the capacitance and electrostatic forces. However, the standard elements with low-order polynomial basis functions cannot produce accurate solutions in the vicinity of sharp corners and edges. This paper describes the formulation of new singular elements and their application to electromechanical coupling analysis. These singular elements are specially designed to handle the singularities in the potential gradient at sharp corners and edges, thereby improving the accuracy of the electrostatic analysis of the simulations of MEMS devices. Numerical simulations of micro-beam switches, comb-drive and micro-mirror are conducted, and the effects of using the singular elements are investigated.
Source Title: Journal of Micromechanics and Microengineering
URI: http://scholarbank.nus.edu.sg/handle/10635/61321
ISSN: 09601317
DOI: 3/319
Appears in Collections:Staff Publications

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