Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2011.10.211
Title: Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging
Authors: Song, X.
Yeap, K.B.
Zhu, J.
Belnoue, J.
Sebastiani, M.
Bemporad, E.
Zeng, K. 
Korsunsky, A.M.
Keywords: Digital image correlation
Focused Ion Beam
Residual stress
Strain relief function
Issue Date: 1-Jan-2012
Source: Song, X., Yeap, K.B., Zhu, J., Belnoue, J., Sebastiani, M., Bemporad, E., Zeng, K., Korsunsky, A.M. (2012-01-01). Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging. Thin Solid Films 520 (6) : 2073-2076. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2011.10.211
Abstract: Residual stress evaluation in thin films at the sub-micron scale was achieved in the present study using a semi-destructive trench-cutting (ring-core) method. Focused Ion Beam was employed to introduce the strain relief by milling the slots around an "island" and also to record the images for strain change evaluation by digital image correlation analysis of micrographs. Finite element simulation was employed to predict the curves for strain relief as a function of milling depth, and compared with the experimental measurements, showing good agreement. An empirical mathematical description of the curves was proposed that allows efficient data analysis for residual stress evaluation. © 2011 Elsevier B.V. All rights reserved.
Source Title: Thin Solid Films
URI: http://scholarbank.nus.edu.sg/handle/10635/61229
ISSN: 00406090
DOI: 10.1016/j.tsf.2011.10.211
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