Please use this identifier to cite or link to this item: https://doi.org/10.1109/TCAPT.2009.2033039
Title: Integrated liquid cooling systems for 3-D stacked TSV modules
Authors: Tang, G.Y.
Tan, S.P.
Khan, N.
Pinjala, D.
Lau, J.H.
Yu, A.B.
Vaidyanathan, K. 
Toh, K.C.
Keywords: 3-D TSV module
Integrated cooling solution
Pressure drop
Thermal management
Issue Date: Mar-2010
Source: Tang, G.Y., Tan, S.P., Khan, N., Pinjala, D., Lau, J.H., Yu, A.B., Vaidyanathan, K., Toh, K.C. (2010-03). Integrated liquid cooling systems for 3-D stacked TSV modules. IEEE Transactions on Components and Packaging Technologies 33 (1) : 184-195. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2009.2033039
Abstract: In this paper, an integrated liquid cooling system for 3-D stacked modules with high dissipation level is proposed. The fluidic interconnects in this system are elaborated and the sealing technique for different fluid interfaces is discussed. Meanwhile, the pressure drop for each part of the system is analyzed. The optimized fluidic interconnects minimizing the pressure drop have been designed and fabricated, and the compact system is integrated. In line with the fluidic interconnect design and analysis, an experimental process for hydraulic characterization of the integrated cooling system is established. The pressure drops for different fluidic interconnects in this system are measured and compared with the analyzed results. © 2006 IEEE.
Source Title: IEEE Transactions on Components and Packaging Technologies
URI: http://scholarbank.nus.edu.sg/handle/10635/60565
ISSN: 15213331
DOI: 10.1109/TCAPT.2009.2033039
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