Please use this identifier to cite or link to this item: https://doi.org/10.1109/TCPMT.2013.2244164
Title: Hotspot mitigating with obliquely finned microchannel heat sink-an experimental study
Authors: Lee, Y.J.
Lee, P.S. 
Chou, S.K. 
Keywords: Enhanced microchannel
hotspot cooling
oblique fins
variable pitch
Issue Date: 2013
Source: Lee, Y.J., Lee, P.S., Chou, S.K. (2013). Hotspot mitigating with obliquely finned microchannel heat sink-an experimental study. IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (8) : 1332-1341. ScholarBank@NUS Repository. https://doi.org/10.1109/TCPMT.2013.2244164
Abstract: Sectional oblique fins are employed, in contrast to continuous fins, in order to modulate the flow in a microchannel heat sink. The breakage of continuous fin into oblique sections leads to reinitialization of boundary layers and generation of secondary flows that significantly enhance the cooling performance of the heat sink. In addition, an oblique finned microchannel heat sink has the flexibility to tailor local heat transfer performance by varying its oblique fin pitch. Clusters of oblique fins at higher density can be created in order to promote a greater degree of boundary layer redevelopment and secondary flow generation to provide more effective cooling at the high heat-flux region. Thus, the variation of oblique fin pitch can be exploited for hotspot mitigation. Experimental studies of a silicon chip with two hotspot scenarios show that the temperature hike and the temperature difference for the enhanced microchannel heat sink with variable pitch are reduced by as much as 17.1 °C and 15.4 °C, respectively. As a result, temperature distribution across the silicon chip is more uniform. In addition, the associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective hotspot mitigating strategy for the single-phase microchannel heat sink. © 2012 IEEE.
Source Title: IEEE Transactions on Components, Packaging and Manufacturing Technology
URI: http://scholarbank.nus.edu.sg/handle/10635/60456
ISSN: 21563950
DOI: 10.1109/TCPMT.2013.2244164
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