Please use this identifier to cite or link to this item: https://doi.org/10.1109/TCAPT.2005.848580
Title: Finite element modeling of electronic packages subjected to drop impact
Authors: Tan, V.B.C. 
Tong, M.X.
Lim, K.M. 
Lim, C.T. 
Keywords: Ball grid array (BGA)
Drop impact
Finite element (FE) simulation
Issue Date: Sep-2005
Source: Tan, V.B.C.,Tong, M.X.,Lim, K.M.,Lim, C.T. (2005-09). Finite element modeling of electronic packages subjected to drop impact. IEEE Transactions on Components and Packaging Technologies 28 (3) : 555-560. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2005.848580
Abstract: As more electronic products become portable, many product manufacturers have started to pay more attention to the robustness of their products. Finite element (FE) simulation has become increasingly popular in the analysis of products subjected to impact loading. The need for details in a FE mesh is always balanced by considerations of simulation time and available computational resources. In this paper, three commonly used approaches to FE modeling of a ball grid array (BGA) package subjected to drop impact are evaluated. The first model comprises a detailed mesh of the printed circuit board (PCB), integrated circuit (IC) package and interconnecting solder balls using solid three-dimensional (3-D) elements. The degrees of freedom is reduced for the second mesh by using shell elements for the PCB and IC package while retaining the detailed mesh of the solder balls using solid 3-D elements. The third mesh is a further simplification of the second mesh whereby the solder balls are replaced by a single beam element each. The stresses within the solder balls are then obtained in a separate FE analysis of a detailed solder ball mesh using the displacement history of nodes around the beam elements from the previous analysis as inputs. Solder ball stresses from all three meshes were found to differ by as much as 40% although PCB deflection compared favorably. © 2005 IEEE.
Source Title: IEEE Transactions on Components and Packaging Technologies
URI: http://scholarbank.nus.edu.sg/handle/10635/60324
ISSN: 15213331
DOI: 10.1109/TCAPT.2005.848580
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