Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.scriptamat.2008.08.020
Title: Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
Authors: Seah, S.K.W. 
Wong, E.H.
Shim, V.P.W. 
Keywords: Drop impact
Electronic packaging
Fatigue crack propagation
Lead-free solder
Low cycle fatigue
Issue Date: Dec-2008
Source: Seah, S.K.W.,Wong, E.H.,Shim, V.P.W. (2008-12). Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading. Scripta Materialia 59 (12) : 1239-1242. ScholarBank@NUS Repository. https://doi.org/10.1016/j.scriptamat.2008.08.020
Abstract: The fatigue crack growth in a solder joint was monitored during dynamic cyclic loading induced by mechanical shock. Crack growth was tracked via measurement of tiny resistance changes in the solder joint coupled with computational simulations of cracked joints. The unique fatigue characteristics observed are an insignificant crack nucleation period and a distinctive growth pattern for bulk solder cracks. Crack growth accelerates upon movement of the crack into intermetallic regions, a common occurrence for lead-free solders under high material strain rates. © 2008 Acta Materialia Inc.
Source Title: Scripta Materialia
URI: http://scholarbank.nus.edu.sg/handle/10635/60301
ISSN: 13596462
DOI: 10.1016/j.scriptamat.2008.08.020
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

18
checked on Dec 13, 2017

WEB OF SCIENCETM
Citations

17
checked on Nov 3, 2017

Page view(s)

47
checked on Dec 9, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.