Please use this identifier to cite or link to this item: https://doi.org/10.1109/TCAPT.2006.880509
Title: Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling
Authors: Liao, E.B.
Tay, A.A.O. 
Ang, S.S.T.
Feng, H.H.
Nagarajan, R.
Kripesh, V.
Keywords: Flip-chip
Multicopper-column (MCC) interconnect
Solder bridging
Soler joint shape
Terms-Fatigue
Wafer-level packaging
Issue Date: Sep-2006
Source: Liao, E.B.,Tay, A.A.O.,Ang, S.S.T.,Feng, H.H.,Nagarajan, R.,Kripesh, V. (2006-09). Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling. IEEE Transactions on Components and Packaging Technologies 29 (3) : 560-569. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2006.880509
Abstract: This paper addresses fatigue and bridging issues by numerical analysis for an ultra-fine-pitch flip-chip interconnect that consists of multiple copper columns (MCC) and a solder joint. First, the processing flow is briefly presented, which enables prototyping of high-aspect-ratio (∼6) copper columns, and hence, enhanced thermomechanical reliability of the interconnects. A public software, Surface Evolver (SE), has been used through this work to predict the solder joint geometry evolution. By integrating SE solder joint shape modeling, stress/strain analysis within ANSYS, and design of experiment (DoE) techniques as well, detailed numerical analysis has been conducted on the solder joint fatigue response to various factors such as the Cu-Solder wetting angle, loading direction, and solder geometry parameters. Finally, by applying the DoE techniques and the most updated features of SE, bridging risks of this interconnect with a fine pitch of 40 μm is investigated, in which critical solder volume is calculated as a function of the interconnect geometry parameters. Based on these results, a solid basis for the design and processing of this advanced flip-chip interconnect has been established. © 2006 IEEE.
Source Title: IEEE Transactions on Components and Packaging Technologies
URI: http://scholarbank.nus.edu.sg/handle/10635/60299
ISSN: 15213331
DOI: 10.1109/TCAPT.2006.880509
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

10
checked on Jan 17, 2018

Page view(s)

34
checked on Jan 14, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.