Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.jmatprotec.2008.10.041
Title: Fabrication of complex shape electrodes by localized electrochemical deposition
Authors: Habib, M.A.
Gan, S.W.
Rahman, M. 
Keywords: EDM electrode
Localized electrochemical deposition
Microfabrication
Issue Date: 1-May-2009
Source: Habib, M.A.,Gan, S.W.,Rahman, M. (2009-05-01). Fabrication of complex shape electrodes by localized electrochemical deposition. Journal of Materials Processing Technology 209 (9) : 4453-4458. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jmatprotec.2008.10.041
Abstract: Localized electrochemical deposition (LECD) is a promising technology for fabrication of high-aspect ratio electrode of various materials. This technology is found to be one of the simple and inexpensive ways to fabricate electrodes for micro-EDM. This study presents a novel method to manufacture electrodes with complex cross-section using mask of non-conductive material. In this study, the mask is placed between the anode and cathode, which is immersed in mixed electrolyte of copper sulfate, 1.0 M sulfuric acid and as an additive agent 0.04 g/l of thiourea. The deposition of copper is localized on the cathode surface using a mask and applying ultra short voltage pulses between the anode and cathode. In this setup the cathode is placed above the anode and mask, so that the deposited electrode can be used directly for EDM or any application without changing tool orientation. The deposition characteristics such as size, shape, surface, and structural density according to gap between the anode and mask, applied voltage, pulse frequency and duty ratio have been investigated in this study. Finally, appropriate conditions have been found out for effective fabrication of smooth and fine-grained deposited electrodes based on the findings of the various experiments. © 2008 Elsevier B.V. All rights reserved.
Source Title: Journal of Materials Processing Technology
URI: http://scholarbank.nus.edu.sg/handle/10635/60281
ISSN: 09240136
DOI: 10.1016/j.jmatprotec.2008.10.041
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